Glass Thinning UV Adhesive for Semiconductor Back Grinding Strong Holding and Easy Debonding

This temporary bonding adhesive is specially developed for high-precision thinning, back grinding, grinding, and cutting processes. It is suitable for wafers, chips, ultra-thin glass, sapphire, ceramic sheets, optical panels, and other fragile substrates. The adhesive provides strong temporary fixation, high adhesion, impact resistance, and excellent resistance to acid and alkali environments, helping prevent displacement, cracking, and breakage during thinning or grinding. After processing, the adhesive can be debonded, making it ideal for semiconductor wafer back grinding, chip process support, sapphire thinning, ceramic sheet grinding, and optical thin sheet processing.