UV Curable Encapsulants
Protect sensitive electronic components against moisture, dust, shock, and vibration with rapid UV curing.
Key Features
- ✓ Rapid UV curing with secondary moisture cure for shadow areas
- ✓ Low stress and minimal shrinkage
- ✓ Excellent moisture and chemical resistance
- ✓ Good thermal stability and flexible grades available
Typical Applications
LED Module Encapsulation
Protect LED chips with optical-grade clarity
Sensor Protection
Environmental sealing for pressure, temperature, and gas sensors
Chip-on-Board (COB)
Wire bond and die protection in COB assemblies