Cationic UV Adhesive

Designed for high-precision bonding, fixing, and sealing applications in electronic, optical, glass, metal, ceramic, sensor, and IC packaging assemblies.

The adhesive is suitable for high-reliability applications requiring low shrinkage, strong adhesion, acid and alkali resistance, heat resistance, and stable sealing performance. Its cationic curing system provides excellent dark curing capability and avoids oxygen inhibition, making it suitable for precision structures, shadow areas, and complex bonding interfaces.

Suitable for precision electronic assembly, optical bonding, glass-to-metal bonding, ceramic component bonding, sensor sealing, IC packaging, and chemical-resistant sealing applications.