Wafer Thinning

Designed for temporary fixing and process protection during semiconductor wafer thinning, back grinding, dicing, and ultra-thin chip processing.

The adhesive provides high adhesion and impact resistance to firmly support thin wafers during processing, helping reduce wafer cracking, shifting, and edge damage. After thinning or grinding, adhesion can be reduced by UV exposure or heat, allowing easy removal and clean separation.

Suitable for wafer back grinding, pre-dicing fixation, ultra-thin chip support, and power device process protection.