Electronic Industry

Designed for electronic and communication industry applications, including component fixing, PCB protection, optical module bonding, LCD assembly, optical fiber fixing, and wafer bonding.

The adhesive is developed to meet the key requirements of electronic assembly processes, such as fast curing speed for high-efficiency production, low odor for cleaner manufacturing environments, stable anti-yellowing performance for appearance-sensitive components, and reliable adhesion for mixed-material bonding applications including plastics, metals, glass, and optical parts.

Suitable for automated dispensing and precision assembly processes in electronic manufacturing applications.