Water-Removable Protection

Designed for temporary fixing and protection applications where residue-free removal is required. Suitable for semiconductor wafers, MEMS devices, fragile glass, ceramic substrates, and other precision components.

After UV curing, the adhesive can be removed through warm water, deionized water, or mild alkaline solution without mechanical force, helping reduce the risk of damage to delicate substrates. It provides reliable temporary protection during cutting, grinding, polishing, and processing operations.

Suitable for precision manufacturing processes requiring clean removal, low residue, and high substrate protection