Die Attach

Designed for high-precision chip fixing in semiconductor and LED packaging processes, including LED chips, IC bare dies, and semiconductor die attach applications.

Suitable for chips, dies, LED brackets, ceramic substrates, metal substrates, PCBs, and lead frames.

The adhesive features high bonding strength, low shrinkage, high temperature resistance, good thermal conductivity, stable positioning, and high reliability, making it suitable for precise chip fixation and die attach packaging applications.