This UV curing adhesive is specially developed for chip fixing and die attach applications in semiconductor and LED packaging. It is suitable for LED chips, IC dies, semiconductor dies, LED brackets, ceramic substrates, metal substrates, PCB boards, and lead frames. The adhesive provides high bonding strength, low shrinkage, good thermal conductivity, high temperature resistance, and stable positioning performance, helping improve assembly accuracy and long-term reliability in precision electronic packaging.
Die Attach
UV Die Attach Adhesive for LED Chip Bonding, Low Shrinkage & High Thermal Stability
UV curing adhesive designed for LED chip, IC die, and semiconductor die fixing in die attach packaging.
Provides high bonding strength, low shrinkage, and stable positioning for precision semiconductor and LED assembly.
Reviews
There are no reviews yet.